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Immersion lithography

In immersion lithography, light travels down through a system of lenses and then a pool of water before reaching the photoresist on top of the wafer.

Immersion lithography is a technique used in semiconductor manufacturing to enhance the resolution and accuracy of the lithographic process. It involves using a liquid medium, typically water, between the lens and the wafer during exposure. By using a liquid with a higher refractive index than air, immersion lithography allows for smaller features to be created on the wafer.[1]

Immersion lithography replaces the usual air gap between the final lens and the wafer surface with a liquid medium that has a refractive index greater than one. The angular resolution is increased by a factor equal to the refractive index of the liquid. Current immersion lithography tools use highly purified water for this liquid, achieving feature sizes below 45 nanometers.[2]

  1. ^ Flagello, Donis (2004-01-01). "Benefits and limitations of immersion lithography". Journal of Micro/Nanolithography, MEMS, and MOEMS. 3 (1): 104. Bibcode:2004JMM&M...3..104M. doi:10.1117/1.1636768. ISSN 1932-5150.
  2. ^ "DailyTech - IDF09 Intel Demonstrates First 22nm Chips Discusses Die Shrink Roadmap". Archived from the original on 2010-08-28. Retrieved 2009-12-07.

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